Dark Blue: Firm commitments from incumbent: BT (10M), Belgacom, Australian NBN, Swisscom, Austria, Bezeq Israel, Chunghwa Taiwan, Telus Canada, Telekom South Africa, SK Korea, (U.S.) AT&T, Century, Frontier, Windstream, Belgium, Omantel
Mid Blue: Smaller carriers in Germany, Norway, Finland, Japan
- Published: 04 June 2016 04 June 2016
Combine that claim with this comment in the release: “GigaDSL addresses the unique requirements of Japanese carriers with key capabilities including multi operator environment and interoperability with deployed VDSL CPEs?" The implication would seem ?to be that Ikanos is vectoring existing VDSL from competitors with G.fast. That would be a major achievement but is unlikely.
MAY 31, 2016 TAIPEI, TAIWAN
Qualcomm Incorporated (NASDAQ: QCOM) today announced at COMPUTEX 2016 that its subsidiary, Qualcomm Technologies, Inc., introduced end-to-end GigaDSL products that enable broadband operators to seamlessly transition deployments from VDSL to Gigabit access technologies. Designed to meet the requirements for the migration for existing VDSL by operators, especially in Korea and Japan, the new QCO5700 for multiple dwelling units (MDU) and the QCM5720 for customer premises equipment (CPE) can provide up to 1 Gigabit per second (Gbps) broadband over existing telephone lines – while maintaining interoperability with carriers’ existing modems and seamless coexistence with deployed infrastructure.
The new GigaDSL chipsets are ideal as operators keep pace with consumer demand and national mandates for broadband access, with minimal service interruption. They are the industry’s first wireline solutions to support Gigabit data rates up to 100m on existing telephone lines providing a high-speed extension for VDSL without losing any spectrum capacity. The existing deployment base can be upgraded to products based on Qualcomm Technologies’ latest GigaDSL processors, without costly and time intensive wiring on-premise.
“We are committed to driving leading edge technologies to meet carrier's unique requirements, including in Japan and Korea,” said Irvind Ghai, vice president of product management, Qualcomm Atheros, Inc. “With these new GigaDSL product offerings, we are able to meet carriers’ broadband goals, complementing fiber deployment in time for major events, such as the 2018 Winter Games in Korea and the 2020 Summer Games in Japan.”
Several leading manufacturers are already building or preparing to build products based on the QCO5700 and QCM5720, including Sumitomo Electronic, NEC and Wave Electronics.
“We are going to make every possible effort to replace our 1G-EPON FTTH products with 10G-EPON products in the FTTH market in Japan. The transition from VDSL to G.Fast (FDD) ‘GigaDSL’ is an important segment to realize this ‘10G upgrade’ for Telco carriers in order to complement the fiber deployment in MDU in Japan, and we are working closely with them and Qualcomm Technologies to deliver the solutions needed to make this a seamless transition,” said Hiroaki Nishimoto, general manager, broad networks division, Sumitomo Electric. “Sumitomo brings to bear our history of infrastructure expertise to make 10 Gigabit access technologies a reality.”
“GigaDSL addresses the unique requirements of Japanese carriers with key capabilities including multi operator environment and interoperability with deployed VDSL CPEs,” said Kazunori Sakai, general manager, network solutions division of NEC Magnus Communications, Ltd. “Incorporating these newest products into our technology solutions is a testament to our industry leadership in Japan as well as our continued relationship with Qualcomm Technologies.”
“Through our collaboration with Qualcomm Technologies, we can provide our customers with a seamless broadband connection that can meet the demands of increasingly crowded networks,” said Soon-Hwan Lee, chief executive officer, Wave Electronics. “With the new GigaDSL products, users do not need to worry about interoperability during the transition to Gigabit access technologies.”
Sampling for Qualcomm Technologies’ GigaDSL chipsets is expected to be available June 2016, both for Fiber to the Building (FTTB) infrastructure and CPE.